Contributors

Ray Chou

Ray Chou is a Financial Services Partner at Oliver Wyman Greater China.

Ray Suvrodeep

Ray Suvrodeep is Managing Director - Treasury Solutions Group & Liquidity Solutions, Global Payments Solutions at HSBC, based in Singapore. Suvrodeep has extensive experience in treasury and liquidity management at leading financial institutions in Asia.

Raymond Kosasih

Rebecca Tan

Regina Liu

Renee Koh

Ms Renee Koh is the Head of Swiss Business Hub ASEAN. The Swiss Business Hub ASEAN is the representative of the official international trade and investment promotion agency Switzerland Global Enterprise in Southeast Asia.

Reshmi Raj

Reto Gruenenfelder PhD

Reto Gruenenfelder PhD is a distinguished Engineer. He is also the Chief Technology Officer of Financial Services at IBM Asia Pacific. 

Reuben Bernard

Head of Marketing @ Payjo (https://payjo.co/) is an experienced marketing professional with 12+ years experience. Possess excellent analytic skills and skilled at managing risks and handling challenges. He blogs regularly on Chatbots and artificial intelligence in banking industry.

Rich Chun

Richard Chun is Head of Asia Pacific at Tradeweb, overseeing the firm’s business operations, client engagement efforts, and strategic growth initiatives across the region. A seasoned fixed income investor and trading leader, Mr. Chun brings over three decades of experience in global markets.

Prior to joining Tradeweb, Mr. Chun was a Managing Director and Portfolio Manager at HPS Investment Partners. He was previously a Portfolio Manager at Claren Road Asset Management, where he established the firm’s Hong Kong office in 2008 and served as Co-Head of its Asian business strategy.

Mr. Chun spent over 14 years at Citigroup, where his most recent role was Head of Credit Trading for Asia. Before relocating to Hong Kong in 2001, he traded high-yield corporate debt, focusing on Emerging Markets, in New York. He began his career in the Sales and Trading Program at Salomon Brothers.

Mr. Chun holds a Bachelor of Science from the Columbia University School of Engineering and Applied Science.