HKMA launches digital bond grant scheme to boost digital securities market

Issuers of eligible digital bonds may receive a maximum grant of $2.5m.

The Hong Kong Monetary Authority (HKMA) has launched the Digital Bond Grant Scheme (DBGS), first announced in the 2024 Policy Address.

The scheme aims to foster the growth of the digital securities market and encourage the use of tokenisation technology in capital market transactions.

Under the DBGS, issuers of eligible digital bonds may receive a maximum grant of $2.5m, subject to meeting specified eligibility requirements.

Following industry consultation, the HKMA has outlined the scheme’s details and began accepting applications on 28 November, with the scheme set to run initially for three years.

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Hong Kong Monetary Authority

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